Manipulate valves, switches, and buttons, or key commands into control panels to start semiconductor processing cycles.
Maintain processing, production, and inspection information and reports.
Inspect materials, components, or products for surface defects and measure circuitry, using electronic test equipment, precision measuring instruments, microscope, and standard procedures.
Clean semiconductor wafers using cleaning equipment, such as chemical baths, automatic wafer cleaners, or blow-off wands.
Study work orders, instructions, formulas, and processing charts to determine specifications and sequence of operations.
Load and unload equipment chambers and transport finished product to storage or to area for further processing.
Set, adjust, and readjust computerized or mechanical equipment controls to regulate power level, temperature, vacuum, and rotation speed of furnace, according to crystal growing specifications.
Etch, lap, polish, or grind wafers or ingots to form circuitry and change conductive properties, using etching, lapping, polishing, or grinding equipment.
Load semiconductor material into furnace.
Monitor operation and adjust controls of processing machines and equipment to produce compositions with specific electronic properties, using computer terminals.